Methods and systems for use in grind shape control adaptation
US9457446B2 · kind B2 · utility
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35References
3Claims
0Family size
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Key dates
| Filing date | Sep 30, 2013 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Nov 22, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.