Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same
US9458365B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2014 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Jul 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.