Substrate processing apparatus
US9464353B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2013 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Apr 11, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45551
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a substrate processing apparatus: including a chamber comprising a body having an inner space and a top lid provided on an upper part of the body, the top lid having at least one gas input port; a substrate supporting unit rotatably installed inside the chamber to support a plurality of substrates; and a gas injection device comprising a central injection unit provided on an upper part of the substrate supporting unit to inject a gas into a central region of the substrate supporting unit, a source gas injection unit provided around the central injection unit to inject a source gas into the substrate supporting unit, a reaction gas injection unit provided around the central injection unit to inject a reaction gas into the substrate supporting unit and a purge gas injection unit disposed between the source gas injection unit and the reaction gas injection unit; wherein at least one of the source gas injection unit and the reaction gas injection unit comprises a main injection unit to inject a gas into the substrate supporting unit and a gas-injecting projection projecting in a intersectional direction to the main injection unit between the central inj…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.