Patent · US Active

Systems and methods for drying high aspect ratio structures without collapse using stimuli-responsive sacrificial bracing material

US9466511B2 · kind B2 · utility

3Cited by
6References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 18, 2014
Grant dateOct 11, 2016
Priority date—
Expiry dateSep 18, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67028
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Systems and methods for drying a substrate including a plurality of high aspect ratio (HAR) structures is performed after at least one of wet etching and/or wet cleaning the substrate using at least one of wet etching fluid and/or wet cleaning fluid, respectively, and without drying the substrate. Fluid between the plurality of HAR structures is displaced using a solvent including a bracing material. After the solvent evaporates, the bracing material precipitates out of solution and at least partially fills the plurality of HAR structures. The plurality of HAR structures are exposed to non-plasma based stimuli to remove the bracing material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.