Ratchana Limary
4Patents
2h-index
4Co-inventors
33Inventor score
Filing activity: Oct 11, 2012 → Jan 28, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8898928B2 | Delamination drying apparatus and method | Electricity | 12 | Active |
| US9466511B2 | Systems and methods for drying high aspect ratio structures without collapse using stimuli-responsive sacrificial bracing material | Electricity | 3 | Active |
| US12119218B2 | Sacrificial protection layer for environmentally sensitive surfaces of substrates | Electricity | 1 | Active |
| US10008396B2 | Method for collapse-free drying of high aspect ratio structures | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.