Low void solder joint for multiple reflow applications
US9468136B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2014 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Feb 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12222
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.