Graphene cap for copper interconnect structures
US9472450B2 · kind B2 · utility
12Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2012 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Jan 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Interconnect structures including a graphene cap located on exposed surfaces of a copper structure are provided. In some embodiments, the graphene cap is located only atop the uppermost surface of the copper structure, while in other embodiments the graphene cap is located along vertical sidewalls and atop the uppermost surface of the copper structure. The copper structure is located within a dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.