Inventor · Yorktown Heights, NY, US

Qinghuang Lin

135Patents
15h-index
130Co-inventors
89Inventor score

Filing activity: Feb 25, 1998 → Oct 5, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8241992B2 Method for air gap interconnect integration using photo-patternable low k material Electricity 401 Active
US6087064A Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method Emerging Cross-Sectional Technologies 139 Expired
US7041748B2 Patternable low dielectric constant materials and their use in ULSI interconnection Emerging Cross-Sectional Technologies 67 Expired
US6210856A Resist composition and process of forming a patterned resist layer on a substrate Physics 59 Expired
US7306853B2 Patternable low dielectric constant materials and their use in ULSI interconnection Emerging Cross-Sectional Technologies 48 Expired
US6340734B1 Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method Emerging Cross-Sectional Technologies 37 Expired
US6187505A Radiation sensitive silicon-containing resists Physics 25 Expired
US9490202B2 Self-aligned airgap interconnect structures Electricity 22 Active
US6344305B1 Radiation sensitive silicon-containing resists Physics 21 Expired
US7709370B2 Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures Emerging Cross-Sectional Technologies 20 Active
US7479306B2 SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same Emerging Cross-Sectional Technologies 18 Active
US8617941B2 High-speed graphene transistor and method of fabrication by patternable hard mask materials Electricity 18 Active
US8900988B2 Method for forming self-aligned airgap interconnect structures Electricity 17 Active
US6103447A Approach to formulating irradiation sensitive positive resists Emerging Cross-Sectional Technologies 15 Expired
US7919225B2 Photopatternable dielectric materials for BEOL applications and methods for use Emerging Cross-Sectional Technologies 15 Active
US9647200B1 Encapsulation of magnetic tunnel junction structures in organic photopatternable dielectric material Electricity 14 Active
US7361444B1 Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof Emerging Cross-Sectional Technologies 12 Expired
US9472450B2 Graphene cap for copper interconnect structures Electricity 12 Active
US8642252B2 Methods for fabrication of an air gap-containing interconnect structure Electricity 11 Active
US9054160B2 Interconnect structure and method for fabricating on-chip interconnect structures by image reversal Electricity 10 Active
US8659115B2 Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating Electricity 10 Active
US8519540B2 Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same Electricity 10 Active
US6303263A Irradiation sensitive positive-tone resists using polymers containing two acid sensitive protecting groups Emerging Cross-Sectional Technologies 10 Expired
US6258732A Method of forming a patterned organic dielectric layer on a substrate Electricity 9 Expired
US8029971B2 Photopatternable dielectric materials for BEOL applications and methods for use Emerging Cross-Sectional Technologies 9 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.