Methods of cross-coupling line segments on a wafer
US9472455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2014 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Jun 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for fabricating cross-coupled line segments on a wafer for use, for instance, in fabricating cross-coupled gates of two or more transistors. The fabricating includes: patterning a first line segment with a first side projection using a first mask; and patterning a second line segment with a second side projection using a second mask. The second line segment is offset from the first line segment, and the patterned second side projection overlies the patterned first side projection, and facilitates defining a cross-stitch segment connecting the first and second line segments. The method further includes selectively cutting the first and second line segments in defining the cross-coupled line segments from the first and second line segments and the cross-stitch segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.