Jason E. Stephens
40Patents
10h-index
66Co-inventors
70Inventor score
Filing activity: Jan 16, 2012 → Nov 15, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9818641B1 | Apparatus and method of forming self-aligned cuts in mandrel and a non-mandrel lines of an array of metal lines | Electricity | 20 | Active |
| US9825031B1 | Methods of forming a high-k contact liner to improve effective via separation distance and the resulting devices | Electricity | 16 | Active |
| US9852986B1 | Method of patterning pillars to form variable continuity cuts in interconnection lines of an integrated circuit | Electricity | 14 | Active |
| US9818640B1 | Apparatus and method of forming self-aligned cuts in a non-mandrel line of an array of metal lines | Electricity | 14 | Active |
| US9818651B2 | Methods, apparatus and system for a passthrough-based architecture | Electricity | 14 | Active |
| US8969199B1 | Methods of forming a circuit that includes a cross-coupling gate contact structure wherein the circuit is to be manufactured using a triple patterning process | Electricity | 13 | Active |
| US9236437B2 | Method for creating self-aligned transistor contacts | Electricity | 11 | Active |
| US9202751B2 | Transistor contacts self-aligned in two dimensions | Electricity | 11 | Active |
| US8839168B2 | Self-aligned double patterning via enclosure design | Physics | 10 | Active |
| US9224617B2 | Forming cross-coupled line segments | Electricity | 10 | Active |
| US8793627B1 | Via non-standard limiting parameters | Physics | 9 | Active |
| US9006100B2 | Middle-of-the-line constructs using diffusion contact structures | Electricity | 8 | Active |
| US9786545B1 | Method of forming ANA regions in an integrated circuit | Electricity | 8 | Active |
| US8946914B2 | Contact power rail | Electricity | 6 | Active |
| US9818623B2 | Method of forming a pattern for interconnection lines and associated continuity blocks in an integrated circuit | Electricity | 5 | Active |
| US8856715B1 | Capacitor designs for integrated circuits utilizing self-aligned double patterning (SADP) | Physics | 5 | Active |
| US8987816B2 | Contact power rail | Electricity | 5 | Active |
| US9691626B1 | Method of forming a pattern for interconnection lines in an integrated circuit wherein the pattern includes gamma and beta block mask portions | Electricity | 5 | Active |
| US9779943B2 | Compensating for lithographic limitations in fabricating semiconductor interconnect structures | Electricity | 4 | Active |
| US11043418B2 | Middle of the line self-aligned direct pattern contacts | Electricity | 3 | Active |
| US8598633B2 | Semiconductor device having contact layer providing electrical connections | Electricity | 3 | Active |
| US10236350B2 | Method, apparatus and system for a high density middle of line flow | Electricity | 3 | Active |
| US9412655B1 | Forming merged lines in a metallization layer by replacing sacrificial lines with conductive lines | Electricity | 2 | Active |
| US9472455B2 | Methods of cross-coupling line segments on a wafer | Electricity | 2 | Active |
| US10181420B2 | Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.