Circuit substrate and method of manufacturing same
US9474162B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2014 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Apr 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit interconnecting substrate manufacturing method includes depositing a first layer of metallic powder on top of a carrier, and then forming a first layer of electrically conductive traces from the first layer of metallic powder. A second layer of metallic powder is then deposited onto at least one region of the first layer of electrically conductive traces. Then a second layer of electrically conductive traces is formed from the second layer of metallic powder and each trace of the second layer is electrically coupled to a trace of the first layer. An insulating material is deposited onto the carrier to provide an insulating substrate that supports the traces. The method does not require the use of any wet chemicals or chemical etching steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.