Patent · US Active

ASIC element, in particular as a component of a vertically integrated hybrid component

US9475693B2 · kind B2 · utility

0Cited by

0References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Daniel Christoph Meisel · Pittsburgh, US
Christoph Schelling · Stuttgart, DE
Torsten Kramer · Wannweil, DE
Jens Frey · Echterdingen, DE

Key dates

Filing date	Jun 8, 2015
Grant date	Oct 25, 2016
Priority date	—
Expiry date	Jun 8, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Measures are provided which are used for stabilizing the substructure of the connecting areas of ASIC elements. These measures relate to ASIC elements including an ASIC substrate, into which electrical circuit functions are integrated, and including an ASIC layer structure on the ASIC substrate, which includes multiple wiring levels for the circuit functions, which are separated from one another by insulation layers and are interconnected via metallic plugs. At least one connecting area for placing wire bonds or for wafer bonding is implemented in at least one of the uppermost wiring levels. At least one chain of metallic plugs arranged vertically in a direct line is implemented in the ASIC layer structure below the connecting area, which extends from the uppermost wiring level up to the ASIC substrate or oxide trenches introduced therein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.