Patent · US Active

Semiconductor packages and methods of formation thereof

US9478484B2 · kind B2 · utility

5Cited by

11References

24Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Ralf Otremba · Kaufbeuren, DE
Klaus Schiess · Allensbach, DE
Chee Voon Tan · Seremban, MY

Key dates

Filing date	Oct 19, 2012
Grant date	Oct 25, 2016
Priority date	—
Expiry date	Sep 26, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In accordance with an embodiment of the present invention, a semiconductor device includes a lead frame having a die paddle and a lead. A chip is disposed over the die paddle of the lead frame. The semiconductor device further includes a clip, which is disposed over the chip. The clip couples a pad on the chip to the lead of the lead frame. The clip also includes a heat sink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.