Electronic device package structure and method of fabricating the same
US9478517B2 · kind B2 · utility
5Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2013 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Feb 6, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, an electronic device package structure includes an electronic die having conductive pads on one surface. The one surface is further attached to at least one lead. A conductive layer covers at least one conductive pad and at least portion of the lead thereby electrically connecting the lead to the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.