Method for permanent connection of two metal surfaces
US9478518B2 · kind B2 · utility
3Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2011 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Feb 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.