Patent · US Active

Method for permanent connection of two metal surfaces

US9478518B2 · kind B2 · utility

3Cited by
6References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 23, 2011
Grant dateOct 25, 2016
Priority date
Expiry dateFeb 23, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/14
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.