Device and method for processing wafer-shaped articles
US9484229B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2011 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | May 31, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0318
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for processing wafer-shaped articles includes a spin chuck for holding and rotating a wafer-shaped article about a rotation axis and at least one dispenser for dispensing liquid onto at least one surface of a wafer-shaped article. A liquid collector surrounds the spin chuck for collecting liquid spun off the substrate during rotation, with at least two collector levels for separately collecting liquids in different collector levels. At least one lifting device moves the spin chuck relative to the liquid collector. At least two exhaust levels are provided for separately collecting gas from an interior of the liquid collector. Each of the exhaust levels includes at least one opening communicating with an ambient exterior of the liquid collector and a door that closes and opens the opening. Each door on one of the exhaust levels can be opened and closed separately from each door on another exhaust level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.