Carrier system with multi-tier conductive posts and method of manufacture thereof
US9496152B2 · kind B2 · utility
41Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2010 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Feb 6, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of a carrier system includes: providing a carrier base; forming a recess in the carrier base with the recess around a planar surface; forming a first barrier on the planar surface; forming a second barrier on the carrier base in the recess; forming a first post on the first barrier; and forming a second post on the second barrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.