Patent · US Active

Soldering three dimensional integrated circuits

US9496188B2 · kind B2 · utility

2Cited by

2References

19Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Martin Eckert · Metzingen, DE
Eckhard Kunigkeit · Stuttgart, DE
Otto A. Torreiter · Echterdingen, DE
Quintino L. Trianni · Balingen, DE

Key dates

Filing date	Mar 30, 2015
Grant date	Nov 15, 2016
Priority date	—
Expiry date	Mar 30, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/37001
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for soldering three-dimensional integrated circuits is provided. A three-dimensional integrated circuit is heated to a base temperature, wherein the base temperature is lower than the melting point of a solder, and wherein the three-dimensional integrated circuit includes a plurality of solder bumps. A first on-chip heat source reflows a first portion of the plurality of solder bumps that is within a first local-hot-zone. A second on-chip heat source reflows a second portion of the plurality of solder bumps that is within a second local-hot-zone.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.