Semiconductor chip with structured sidewalls
US9496193B1 · kind B1 · utility
27Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2015 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Sep 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a body having a frontside, a backside opposite the frontside, and sidewalls extending between the backside and frontside, at least a portion of each sidewall having a defined surface structure with hydrophobic characteristics to inhibit travel of a bonding material along the sidewalls during attachment of the semiconductor chip to a carrier with the bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.