Chip package having a light shield
US9496470B2 · kind B2 · utility
1Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2016 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Jan 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/841
Abstract
A chip package has a light shield for blocking the light radiated from the chip. The chip package includes: a chip substrate including a conductive portion and at least one insulating portion electrically separating the conductive portion; an optical device mounted on the chip substrate; a sealing portion sealing the upper surface of the chip substrate; an adhesive bonding the sealing portion to the chip substrate; and a light shield formed in the sealing portion and blocking the light of the optical device from entering into the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.