Low-k damage repair and pore sealing agents with photosensitive end groups
US9502255B2 · kind B2 · utility
4Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Nov 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of repairing damaged low-k dielectric films using UV-activated photosensitive organic compounds are described herein. Methods of sealing pores by exposing porous dielectric films to UV-activated large photosensitive organic compounds are also described. Methods also include mechanically reinforcing dielectric films using photosensitive organic compounds activated by UV radiation. Compounds include at least one photosensitive end group, such as an unsaturated bond or group with high ring strain.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.