Semiconductor package and fabrication method thereof
US9502377B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2013 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Aug 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.