Electronic package and fabrication method thereof
US9502758B2 · kind B2 · utility
0Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2014 |
| Grant date | Nov 22, 2016 |
| Priority date | — |
| Expiry date | Aug 31, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.