High voltage chuck for a probe station
US9506973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2011 |
| Grant date | Nov 29, 2016 |
| Priority date | — |
| Expiry date | Nov 30, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/34
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.