Patent · US Active

Process equipment architecture

US9508576B2 · kind B2 · utility

0Cited by
3References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 1, 2012
Grant dateNov 29, 2016
Priority date
Expiry dateApr 12, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/6719
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication facility floor space requirements. Prior art systems require significant floor space around all sides to allow for adequate installation and servicing. Embodiments of the present invention provide platforms that allow for servicing the chambers and supporting systems via a front and rear of the platform allowing multiple, side-by-side platform placement within a fabrication facility, while providing improved serviceability of the platform components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.