Electrical connector between die pad and z-interconnect for stacked die assemblies

US9508689B2 · kind B2 · utility

Assignee

• Invensas LLC · US

Inventors

• Reynaldo Co · Scotts Valley, US
• Jeffrey S. Leal · Scotts Valley, US
• Suzette K. Pangrle · Cupertino, US
• Scott McGrath · Scotts Valley, US
• De Ann Eileen Melcher · San Jose, US
• Keith L. Barrie · Capitola, US
• Grant Villavicencio · Scotts Valley, US
• Elmer M. Del Rosario · San Jose, US
• John R. Bray · San Jose, US

Key dates

• Filing date: Sep 30, 2015
• Grant date: Nov 29, 2016
• Expiry date: Sep 30, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.