CMP head structure with retaining ring
US9511474B2 · kind B2 · utility
2Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2016 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Jan 25, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A CMP structure for CMP processing and a method of making a device using the same are presented. The apparatus comprises a polishing pad on a platen table; a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes the retaining ring; a sensor for sensing the step height between the retaining ring and its membrane and a controller for adjusting the movement of the retaining ring based on the step height between the retaining ring and its membrane to ensure the step height remains at a fixed value as the retaining ring wears out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.