Microfluidic sensor package structure and method
US9513254B2 · kind B2 · utility
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2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2014 |
| Grant date | Dec 6, 2016 |
| Priority date | — |
| Expiry date | Nov 12, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.