Embedded components in a substrate
US9521754B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2014 |
| Grant date | Dec 13, 2016 |
| Priority date | — |
| Expiry date | Aug 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4652
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded component is formed in a PCB stack by applying an adhesive layer across an entire surface of a copper layer and selectively positioning the component on a portion of the adhesive layer. A B stage pre-preg layer having a component cut-out is added onto the adhesive layer such that the component adhered to the adhesive layer fits within the component cut-out of the B stage pre-preg layer. Another copper layer is added onto the B stage pre-preg layer and the PCB stack is laminated. Since B stage pre-preg is not fully cured, a gap between the component and a side wall of the component cut-out is filled by flow of the surrounding B stage pre-preg during the lamination step. One or more additional pre-preg and copper layers are added to the PCB stack with corresponding interconnects formed and coupled to the contact pads on the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.