Monitor structures and methods of formation thereof
US9530720B2 · kind B2 · utility
1Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2015 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Aug 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with an embodiment of the present invention, a method of forming an electronic device includes forming a first opening and a second opening in a workpiece. The first opening is deeper than the second opening. The method further includes forming a fill material within the first opening to form part of a through via and forming the fill material within the second opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.