Coupling of side surface contacts to a circuit platform
US9530749B2 · kind B2 · utility
0Cited by
70References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2015 |
| Grant date | Dec 27, 2016 |
| Priority date | — |
| Expiry date | Apr 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.