Method and apparatus for liquid treatment of wafer shaped articles
US9536770B2 · kind B2 · utility
2Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2014 |
| Grant date | Jan 3, 2017 |
| Priority date | — |
| Expiry date | Jan 6, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/1993
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing wafer-shaped articles includes a rotary chuck adapted to hold a wafer shaped article thereon. The rotary chuck includes a peripheral series of pins configured to contact an edge region of a wafer-shaped article. Each of the pins projects upwardly from the rotary chuck, and each of the pins is individually secured to the rotary chuck by a respective connecting mechanism. Any selected one of the pins can be removed from the rotary chuck by disconnecting its corresponding connecting mechanism without removing any structure of the rotary chuck that surrounds any others of the pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.