Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

US9536816B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Angela Kessler · Regensburg, DE
• Eduard Knauer · Deuerling, DE
• Rudolf Lehner · Papiermühle, DE
• Wolfgang Schober · Amberg, DE
• Sigrid Schultes · Maxhütte-Haidhof, DE

Key dates

• Filing date: Jul 31, 2015
• Grant date: Jan 3, 2017
• Expiry date: Jul 31, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device.