Method for shaping a laminate substrate
US9543253B2 · kind B2 · utility
1Cited by
14References
20Claims
0Family size
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Key dates
| Filing date | Jan 16, 2015 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Aug 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.