Structures for z-axis interconnection of multilayer electronic substrates
US9545017B2 · kind B2 · utility
8Cited by
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20Claims
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Key dates
| Filing date | Feb 18, 2014 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Feb 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1194
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.