Kenneth C. Holcomb
4Patents
3h-index
7Co-inventors
36Inventor score
Filing activity: Mar 31, 2010 → Feb 18, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9545017B2 | Structures for z-axis interconnection of multilayer electronic substrates | Electricity | 8 | Active |
| US8221518B2 | Conductive compositions containing blended alloy fillers | Electricity | 8 | Active |
| US9005330B2 | Electrically conductive compositions comprising non-eutectic solder alloys | Performing Operations; Transporting | 5 | Active |
| US8840700B2 | Preparation of metallurgic network compositions and methods of use thereof | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.