Method of removing waste of substrate and waste removing device thereof
US9545691B2 · kind B2 · utility
0Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2013 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Dec 29, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B33/0222
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to an exemplary embodiment of the disclosure, a method of removing a waste part of a substrate is provided. The method includes: using a laser to partially drill the substrate to define the waste part; and applying megasonic vibration to the substrate to remove the waste part from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.