Method and apparatus for processing wafer-shaped articles
US9548221B2 · kind B2 · utility
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Key dates
| Filing date | Mar 5, 2014 |
| Grant date | Jan 17, 2017 |
| Priority date | — |
| Expiry date | Jul 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The wet treatment of wafer-shaped articles is improved by utilizing a droplet generator designed to produce a spray of monodisperse droplets. The droplet generator is mounted above a spin chuck, and is moved across a major surface of the wafer-shaped article in a linear or arcuate path. The droplet generator includes a transducer acoustically coupled to its body such that sonic energy reaches a region of the body surrounding the discharge orifices. Each orifice has a width w of at least 1 μm and at most 200 μm and a height h such that a ratio of h to w is not greater than 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.