Copper plating bath composition

US9551080B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Heiko Brunner · Berlin, DE
• Bernd Roelfs · Berlin, DE
• Agnieszka Witczak · Berlin, DE
• Lars Kohlmann · Berlin, DE
• Olivier Mann · Berlin, DE
• Christian Ohde · Berlin, DE
• Timo Bangerter · Berlin, DE
• Angelo Ferro · Berlin, DE
• Andreas Kirbs · Berlin, DE
• Andre Schmökel · Berlin, DE
• Dirk Rohde · Berlin, DE
• Stefanie ACKERMANN · Berlin, DE

Key dates

• Filing date: Nov 12, 2013
• Grant date: Jan 24, 2017
• Expiry date: Nov 12, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76898
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.