Polishing pad with multi-modal distribution of pore diameters
US9555518B2 · kind B2 · utility
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7References
13Claims
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Key dates
| Filing date | Feb 19, 2014 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Apr 4, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.