Apparatuses and methods for die seal crack detection
US9557376B2 · kind B2 · utility
7Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2016 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Mar 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/655
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods can include a die seal between an integrated circuit region of a die and a periphery of the die. A via chain(s) may be arranged around an inner circumference of the die seal between the die seal and the integrated circuit region and/or around an outer circumference of the die seal between the die seal and the periphery of the die. The via chain may include a plurality of contacts comprised of conductive material and extending through portions of the die. Circuitry may be coupled to an end of the via chain to detect an electrical signal. Additional apparatuses and methods are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.