Minimal contact edge ring for rapid thermal processing
US9558982B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2013 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Jan 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the disclosure generally relate to a support ring that supports a substrate in a process chamber. In one embodiment, the support ring comprises an inner ring, an outer ring connecting to an outer perimeter of the inner ring through a flat portion, an edge lip extending radially inwardly from an inner perimeter of the inner ring to form a supporting ledge, and a substrate support extending upwardly from a top surface of the edge lip. The substrate support may be a continuous ring-shaped body disposed around a circumference of the edge lip. The substrate support supports a substrate about its entire periphery from the back side with minimized contact surface to thermally disconnect the substrate from the edge lip. Particularly, the substrate support provides a substantial line contact with the back surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.