Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
US9559075B1 · kind B1 · utility
11Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2016 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Jan 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06513
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.