LED metal substrate package and method of manufacturing same
US9559276B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2013 |
| Grant date | Jan 31, 2017 |
| Priority date | — |
| Expiry date | Dec 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
Abstract
The present invention relates to an LED metal substrate package, and particularly, to an LED metal substrate package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a metal substrate that is electrically separated by at least one vertical insulation layer, the cavity having one vertical insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the metal substrate formed in the respective cavities, with shadow masking; removing an oxide film formed on the surface portions that have not been treated with masking; depositing an electrode layer on each of the surface portions of the oxide layer that have been removed; removing the shadow mask; performing Au/Sn soldering on the electrode layer and bonding an optical device chip; and wire bonding one electrode of the optical device, disposed on one side of the metal substrate with respect to each of the vertical insulation layers, through wires to the metal substrate disposed on the other side of each of the vertical insulation layers. The present invent…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.