In-plane copper imbalance for warpage prediction
US9563732B1 · kind B1 · utility
1Cited by
5References
16Claims
0Family size
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Key dates
| Filing date | Jan 26, 2016 |
| Grant date | Feb 7, 2017 |
| Priority date | — |
| Expiry date | Jan 26, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/26
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of predicting warpage of a laminate is disclosed in which in-plane copper imbalance is calculated. A method of designing an organic build-up laminate is provided in which in-plane copper imbalance is calculated and imbalances are corrected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.