Patent · US Active

Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

US9564400B2 · kind B2 · utility

3Cited by

5References

19Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Reinhard Mahnkopf · Oberhaching, DE
Wolfgang Molzer · Ottobrunn, DE
Bernd Memmler · Riemerling, DE
Edmund Goetz · Dachau, DE
Hans-Joachim Barth · Munich, DE
Sven Albers · Regensburg, DE
Thorsten Meyer · Regensburg, DE

Key dates

Filing date	Jan 28, 2016
Grant date	Feb 7, 2017
Priority date	—
Expiry date	Jan 28, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.