Method for wafer grinding
US9566683B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2015 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Aug 31, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of grinding a wafer includes positioning a wafer beneath a grinding wheel and aligning the wafer and the grinding wheel. The method further includes contacting a grinding surface of an outer base of the grinding wheel with the wafer while rotating at least one of the wafer and the grinding wheel, contacting a grinding surface of an inner frame of the grinding wheel with the wafer while rotating at least one of the wafer and the grinding wheel, without changing the alignment between the wafer and the grinding wheel, and tilting one of the wafer and the grinding wheel relative to the other during at least one of the first and the second contacting steps. The method also includes removing the wafer from the position beneath the grinding wheel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.