Modular grinding apparatuses and methods for wafer thinning
US9570311B2 · kind B2 · utility
6Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2012 |
| Grant date | Feb 14, 2017 |
| Priority date | — |
| Expiry date | Apr 30, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.