Various stress free sensor packages using wafer level supporting die and air gap technique
US9574959B2 · kind B2 · utility
2Cited by
3References
22Claims
0Family size
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Key dates
| Filing date | Oct 17, 2014 |
| Grant date | Feb 21, 2017 |
| Priority date | — |
| Expiry date | Oct 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.