Deposition apparatus and methods to reduce deposition asymmetry
US9580796B2 · kind B2 · utility
32Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2011 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Jun 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3455
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
One or more embodiments of the invention are directed to deposition apparatuses comprising a grounded top wall, a processing chamber and a plasma source assembly having a conductive hollow cylinder and substantially continuous grounded shield substantially conforming to the shape of the hollow cylinder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.